The Korean Society of Surface Science and Engineering

This study investigates the sintering behavior and electrical properties of titanium-dissolved nickel (Ni–Ti) nanoparticles synthesized by arc plasma deposition (APD) for co-fired thick-film Ni-based electrodes in ceramic devices. The Ti content increased linearly with the number of accumulated deposition pulses (up to ~1.81 wt.%). Screen-printed Ni–Ti thick films were heat-treated at 400 ℃ and 1,200 ℃ to examine microstructural evolution. Ti dissolution suppressed Ni grain growth and retarded sintering via Zener pinning, while maintaining low resistivity after 1,200 ℃ sintering. These findings indicate applicability to a broader class of internal/collector electrodes for multilayer ceramic devices that require co-firing with ceramics.

Keywords Ni–Ti composite nanoparticle; arc plasma deposition (APD); titanium dissolution; co-fired thick-film Ni-based electrode; ceramic multilayer devices