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Review
- KISE Journal of Korean Institute of Surface Engineering
- Volume 36(2); 2003
- Article
Review
KISE Journal of Korean Institute of Surface Engineering 2003;36(2):214-225. Published online: Nov, 30, -0001
Underfill Technology
Abstract
Trends in microelectronics packages such as low cost, miniaturization, high performance, and high reliability made area array interconnecting technologies including flip chip, CSP (Chip Scale Package) and BGA (Ball Grid Array) mainstream technologies. Und
Keywords Undefill technology;Flip chip;Chip scale package;Ball grid array;Underfill materials;