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Review
- KISE Journal of Korean Institute of Surface Engineering
- Volume 36(5); 2003
- Article
Review
KISE Journal of Korean Institute of Surface Engineering 2003;36(5):373-378. Published online: Nov, 30, -0001
Fluxless Plasma Soldering with Different Thickness of UBM Layers on Si-Wafer
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서울시립대학교 신소재공학과;서울시립대학교 신소재공학과;서울시립대학교 신소재공학과;서울시립대학교 신소재공학과;University of Waterloo, 기계공학부;
Abstract
With increasing environmental concerns, application of lead-free solder and fluxless soldering process have been taken attention from the electronic packaging industry. Plasma treatment is one of the soldering methods for the fluxless soldering, and it ca
Keywords Plasma Reflow Soldering;Fluxless Soldering;Lead free Solder;UBM;Shear Strength;Bonded Interface;