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Review
- KISE Journal of Korean Institute of Surface Engineering
- Volume 36(5); 2003
- Article
Review
KISE Journal of Korean Institute of Surface Engineering 2003;36(5):386-392. Published online: Nov, 30, -0001
Study on the Characteristics of Electroplated Solder: Comparison of Sn-Cu and Sn-Pb Bumps
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서울시립대학교 신소재공학과;서울시립대학교 신소재공학과;
Abstract
The electroplating process for a solder bump which can be applied for a flip chip was studied. Si-wafer was used for an experimental substrate, and the substrate were coated with UBM (Under Bump Metallization) of Al(400 nm)/Cu(300 nm)Ni(400 nm)/Au(20 nm)
Keywords lead-free solder;Sn-Cu;electroplating;microstructure;joint strength;