Oct, 31, 2024

Vol.57 No.5

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Review

  • KISE Journal of Korean Institute of Surface Engineering
  • Volume 38(3); 2005
  • Article

Review

KISE Journal of Korean Institute of Surface Engineering 2005;38(3):118-125. Published online: Nov, 30, -0001

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Study on Two Step Plasma Treatment for Electroless Cu Plating of Fluoropolymer

  • Shin, Seung-Han;Han, Sung-Ho;Kim, Young-Seok;
    Surface Nano-technology Team, Korea Institute of Industrial Technology(KITECH);Surface Nano-technology Team, Korea Institute of Industrial Technology(KITECH);Surface Nano-technology Team, Korea Institute of Industrial Technology(KITECH);
Abstract

Low temperature plasma treatment with different gases and rf powers were performed to improve the adhesion strength between polytetrafluoroethylene(PTFE) and electroless deposited copper. According to the research, $H_2$ plasma having hydrogen

Keywords Low temperature plasma;PTFE;2-step treatment;Electroless Cu;Surface polarity;Surface roughness;Adhesion;