Oct, 31, 2024

Vol.57 No.5

Current Issue Archives
Search
Advanced Search
Editorial Office

Review

  • KISE Journal of Korean Institute of Surface Engineering
  • Volume 38(6); 2005
  • Article

Review

KISE Journal of Korean Institute of Surface Engineering 2005;38(6):216-226. Published online: Nov, 30, -0001

PDF

A Reliability Test for ph-free SnCu Plating Solution and It`s Deposit

  • Lee Hong-Kee;Hur Jin-Young;
    Korea Institute of Industrial Technology, Nano Surface Technology Team;Korea Institute of Industrial Technology, Nano Surface Technology Team;
Abstract

Pb-Free Technology was born with environmental problems of electronic component, Being connected by big and small project of every country. Also, in each country environment is connected and various standards of IEC, ISO, MIL, JIS, KS, JEDEC, EIAJ etc. Al

Keywords Pb-free;Solder plating;Joint;finishing surface;Reliability;Pb free solder;