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Review
- KISE Journal of Korean Institute of Surface Engineering
- Volume 41(1); 2008
- Article
Review
KISE Journal of Korean Institute of Surface Engineering 2008;41(1):23-27. Published online: Nov, 30, -0001
DOI : 10.5695/JKISE.2008.41.1.023
The Effect of Solution Agitation on the Electroless Cu Deposition Within Nano-patterns
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Department of Surface Technology, Korea of Materials Science;Department of Surface Technology, Korea of Materials Science;Electronic Materials Engineering, Sunmoon University;
Abstract
The effect of solution agitation on the copper electroless deposition process of ULSI (ultra large scale integration) interconnections was investigated by using physical, electrochemical and electrical techniques. It was found that proper solution agitati
Keywords ULSI;Elecroless deposition;Superconformal copper filling;