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KISE Journal of Korean Institute of Surface Engineering 2008;41(6):279-286. Published online: Nov, 30, -0001
DOI : 10.5695/JKISE.2008.41.6.279
Numerical analysis is done to investigate which would be the most influencing process parameter in determining the uniformity of deposition thickness in TiN ICP-CVD(inductively coupled plasma chemical vapor deposition). Two configurations of ICP antenna a
Keywords Plasma;Chemical vapor deposition;Fluid simulation;