Oct, 31, 2024

Vol.57 No.5

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  • KISE Journal of Korean Institute of Surface Engineering
  • Volume 41(6); 2008
  • Article

Review

KISE Journal of Korean Institute of Surface Engineering 2008;41(6):325-330. Published online: Nov, 30, -0001

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DOI : 10.5695/JKISE.2008.41.6.325

An Experimental Study on Electrical and Mechanical Characteristics of Al6061/Al6061 and Al6061/Sus304 by Using Thermal Bonding Technology

  • You, Chung-Jun;Jung, Won-Chae;
    Dept. of Mechanical System Engineering, Kyonggi University;Dept. of Electronic Engineering, Kyonggi University;
Abstract

Al6061 and Sus304 materials are bonded by using thermal bonding technology. Al6061, Sus304 and thermal bonded Al6061/Al6061 and Al6061/Sus304 materials are characterized by using mechanical and electrical measurement. Especially the experimental character

Keywords Bonded material;Al6061/Sus304;FESEM;EDAX;Bonding strength;Hardness;LCR meter;