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Review
- KISE Journal of Korean Institute of Surface Engineering
- Volume 42(4); 2009
- Article
Review
KISE Journal of Korean Institute of Surface Engineering 2009;42(4):145-151. Published online: Nov, 30, -0001
DOI : 10.5695/JKISE.2009.42.4.145
Effect of Current Density and Solution pH on Properties of Electrodeposited Cu Thin Films from Sulfate Baths for FCCL Applications
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Division of Advanced Materials Engineering, Hanbat National University;Division of Advanced Materials Engineering, Hanbat National University;Division of Advanced Materials Engineering, Hanbat National University;
Abstract
Nanocrystalline Cu thin films for FCCL were electrodeposited from sulfate baths to investigate systematically the influences of current density, solution pH on current efficiency, residual stress, surface morphology, and microstructure of thin Cu films. C
Keywords FCCL;Electrodeposition;Current density;pH;Sulfate bath;Residual stress;