Oct, 31, 2024

Vol.57 No.5

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Review

  • KISE Journal of Korean Institute of Surface Engineering
  • Volume 42(5); 2009
  • Article

Review

KISE Journal of Korean Institute of Surface Engineering 2009;42(5):191-196. Published online: Nov, 30, -0001

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DOI : 10.5695/JKISE.2009.42.5.191

Effect of Cu2+ Concentration and Additives on Properties of Electrodeposited Cu Thin Films for FCCL from Sulfate Baths

  • Shin, Dong-Yul;Park, Doek-Yong;Koo, Bon-Keup;
    Division of Advanced Materials Engineering, Hanbat National University;Division of Advanced Materials Engineering, Hanbat National University;Division of Advanced Materials Engineering, Hanbat National University;
Abstract

Nanocrystalline Cu thin films were electrodeposited from sulfate baths and investigated systematically the influences of $Cu^{2+}$ concentration and additives on current efficiency, residual stress, surface morphology, and XRD patterns of elect

Keywords FCCL;Electrodeposite;Sulfate bath;Current efficiency;Residual stress;Surface morphology;