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Review
- KISE Journal of Korean Institute of Surface Engineering
- Volume 46(1); 2013
- Article
Review
KISE Journal of Korean Institute of Surface Engineering 2013;46(1):9-15. Published online: Nov, 30, -0001
DOI : 10.5695/JKISE.2013.46.1.009
Effect of Additional Electrical Current on Adhesion Strength between Copper and Polyimide Films
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Heat Treatment & Plating Technology Center, Incheon Regional Division, Korea Institute of Industrial Technology;Heat Treatment & Plating Technology Center, Incheon Regional Division, Korea Institute of Industrial Technology;Heat Treatment & Plating Techno
Abstract
The effect of the additionally applied electrical current on the adhesion strength between electroless Cu and polyimide films was investigated. Peel tests were performed after applying electrical current within the range from 0.1 to 100 mA for the duratio
Keywords Polyimide;Electroless copper;Electrical current;Adhesion;