Oct, 31, 2024

Vol.57 No.5

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  • KISE Journal of Korean Institute of Surface Engineering
  • Volume 47(1); 2014
  • Article

Review

KISE Journal of Korean Institute of Surface Engineering 2014;47(1):1-6. Published online: Nov, 30, -0001

PDF

DOI : 10.5695/JKISE.2014.47.1.001

Study on Characteristics of Electrodeposited Thin Copper Film by Inorganic Additives in Pyrophosphate Copper Plating Bath

  • Koo, Seokbon;Hur, Jinyoung;Lee, Hongkee;
    Surface Technology R & BD Group, Korea Institute of Industrial Technology;Surface Technology R & BD Group, Korea Institute of Industrial Technology;Surface Technology R & BD Group, Korea Institute of Industrial Technology;
Abstract

The copper deposit on steel plate was prepared by pyrophosphate copper plating solution made with variation of inorganic additive. $NH_4OH$ and $NH_4NO_3$ were used as inorganic additives. The copper layer characteristics - tensile s

Keywords Pyrophosphate copper plating;Tensile strength;Crystal plane orientation;Ammonium nitrate;electrodeposition copper foil;Inorganic additives;