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Review
- KISE Journal of Korean Institute of Surface Engineering
- Volume 47(2); 2014
- Article
Review
KISE Journal of Korean Institute of Surface Engineering 2014;47(2):63-67. Published online: Nov, 30, -0001
DOI : 10.5695/JKISE.2014.47.2.063
The Electrochemical Migration Phenomenon of the Ni-Cr Seed Layer of Sputtered FCCL
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3M AST Ltd.;Department of Industrial Engineering, Ajou University;
Abstract
As the demand for fine-pitch FPCB (Flexible Printed Circuit Board) increases, so do the number of applications of sputtered FCCL (Flexible Copper Clad Laminate). Furthermore, as the width between the circuit patterns decreases, greater defects are observe
Keywords Ion migration;Electrochemical migration;Sputtered FCCL;NiCr seed layer;Circuit short;