Oct, 31, 2024

Vol.57 No.5

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Review

  • KISE Journal of Korean Institute of Surface Engineering
  • Volume 47(2); 2014
  • Article

Review

KISE Journal of Korean Institute of Surface Engineering 2014;47(2):68-74. Published online: Nov, 30, -0001

PDF

DOI : 10.5695/JKISE.2014.47.2.068

A Study on the Seed Step-coverage Enhancement Process (SSEP) of High Aspect Ratio Through Silicon Via (TSV) Using Pd/Cu/PVP Colloids

  • Lee, Dongryul;Lee, Yugin;Kim, Hyung-Jong;Lee, Min Hyung;
    Surface Technology R&BD Group, Korea Institute of Industrial Technology;Surface Technology R&BD Group, Korea Institute of Industrial Technology;Surface Technology R&BD Group, Korea Institute of Industrial Technology;Surface Technology R&BD Group, Korea In
Abstract

The seed step-coverage enhancement process (SSEP) using Pd/Cu/PVP colloids was investigated for the filling of through silicon via (TSV) without void. TEM analysis showed that the Pd/Cu nano-particles were well dispersed in aqueous solution with the avera

Keywords Seed step-coverage enhancement process (SSEP);Pd/Cu/PVP colloids;Through silicon via (TSV);Electrophoresis;