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Review
- KISE Journal of Korean Institute of Surface Engineering
- Volume 47(4); 2014
- Article
Review
KISE Journal of Korean Institute of Surface Engineering 2014;47(4):162-167. Published online: Nov, 30, -0001
DOI : 10.5695/JKISE.2014.47.4.162
Effect of Complexing Agents on Adhesion Strength between Electroless Copper Film and Ta Diffusion Barrier
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Surface Technology R &BD Group, Korea Institute of Industrial Technology;Surface Technology R &BD Group, Korea Institute of Industrial Technology;Surface Technology R &BD Group, Korea Institute of Industrial Technology;Surface Technology R &BD Group, Kore
Abstract
The primary purpose of this research is to investigate how much the complexing agent in electroless Cu electrolytes will affect adhesion strength between copper film and Ta diffusion barrier for Cu interconnect of semiconductor. The adhesion strength usin
Keywords Electroless copper;Adhesion strength;Residual stress;Electrical resistivity;Complexing agent;