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KISE Journal of Korean Institute of Surface Engineering 2014;47(6):275-281. Published online: Nov, 30, -0001
DOI : 10.5695/JKISE.2014.47.6.275
An ultrasound-assisted Sn-Ag-Pd activation method for electroless copper plating was presented in this study. With this activation process, it was shown that the fine catalyst particles were homogeneously distributed with high density on the entire specim
Keywords Ultrasound;Ag activation;Pd activation;electroless copper;Induction time;