Oct, 31, 2024

Vol.57 No.5

Editorial Office

Review

  • KISE Journal of Korean Institute of Surface Engineering
  • Volume 47(6); 2014
  • Article

Review

KISE Journal of Korean Institute of Surface Engineering 2014;47(6):275-281. Published online: Nov, 30, -0001

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Ultrasound Assisted Sn-Ag-Pd Activation Process for Electroless Copper Plating

  • Lee, Chang-Myeon;Hur, Jin-Young;Lee, Hong-Kee;
    Heat Treatment & Plating Technology Center, Incheon Regional Division, Korea Institute of Industrial Technology;Heat Treatment & Plating Technology Center, Incheon Regional Division, Korea Institute of Industrial Technology;Heat Treatment & Plating Techno
Abstract

An ultrasound-assisted Sn-Ag-Pd activation method for electroless copper plating was presented in this study. With this activation process, it was shown that the fine catalyst particles were homogeneously distributed with high density on the entire specim

Keywords Ultrasound;Ag activation;Pd activation;electroless copper;Induction time;