Oct, 31, 2024

Vol.57 No.5

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Review

  • KISE Journal of Korean Institute of Surface Engineering
  • Volume 47(6); 2014
  • Article

Review

KISE Journal of Korean Institute of Surface Engineering 2014;47(6):303-310. Published online: Nov, 30, -0001

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DOI : 10.5695/JKISE.2014.47.6.303

The Effect of Grain Size on the Stress Shift toward Tensile Side by Deposition Interruptions in Copper Thin Films

  • Lee, Seri;Oh, Seungkeun;Kim, Youngman;
    Department of Materials Science and Engineering, Chonnam National University;Department of Materials Science and Engineering, Chonnam National University;Department of Materials Science and Engineering, Chonnam National University;
Abstract

In this study, the average in-situ stress in metallic thin film was measured during deposition of the Cu thin films on the Si(111) wafer and then the phenomenon of stress shift by the interruption of deposition was measured using Cu thin films. We have ob

Keywords thin film;in-situ;stress shift;grain size;E-beam Evaporation;