Oct, 31, 2024

Vol.57 No.5

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Review

  • KISE Journal of Korean Institute of Surface Engineering
  • Volume 48(4); 2015
  • Article

Review

KISE Journal of Korean Institute of Surface Engineering 2015;48(4):131-135. Published online: Nov, 30, -0001

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DOI : 10.5695/JKISE.2015.48.4.131

Characterization of the SnAg Electrodeposits according to the Current Density and Cross-sectional Microstructure Analysis in the Cu Pillar Solder Bump

  • Kim, Sang-Hyuk;Hong, Seong-Ki;Yim, Hyunho;Lee, Hyo-Jong;
    Department of Material Science and Engineering, Dong-A University;Department of Material Science and Engineering, Dong-A University;Department of Material Science and Engineering, Dong-A University;Department of Material Science and Engineering, Dong-A Un
Abstract

We investigated the surface morphology and the change of Ag concentration for SnAg electrodeposits according to the current density using labmade and commercial plating solutions. The concentration of Ag in the SnAg electrodeposits decreased with increasi

Keywords SnAg;Electroplating;Current density;EBSD;Microstructure;