Oct, 31, 2024

Vol.57 No.5

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Review

  • KISE Journal of Korean Institute of Surface Engineering
  • Volume 50(1); 2017
  • Article

Review

KISE Journal of Korean Institute of Surface Engineering 2017;50(1):29-34. Published online: Nov, 30, -0001

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DOI : 10.5695/JKISE.2017.50.1.29

Effects of Ni Concentration on Residual Stress in Electrodeposited Ni Thin Film for 63Ni Sealed Source

  • Yoon, Pilgeun;Park, Deok-Yong;
    Department of Advanced Materials Engineering, Hanbat National University;Department of Advanced Materials Engineering, Hanbat National University;
Abstract

Chloride plating solution was fabricated by dissolving metal Ni powders in a mixed solution with HCl and de-ionized water. Effects of $Ni^{2+}$ and saccharin concentrations in the plating baths on current efficiency, residual stress, surface mo

Keywords $^{63}Ni$ sealed source;Electrodeposition;Current efficiency;Residual stress;Microstructure;