Oct, 31, 2024

Vol.57 No.5

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Review

  • KISE Journal of Korean Institute of Surface Engineering
  • Volume 50(3); 2017
  • Article

Review

KISE Journal of Korean Institute of Surface Engineering 2017;50(3):155-163. Published online: Nov, 30, -0001

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DOI : 10.5695/JKISE.2017.50.3.155

The Stability of Plating Solution and the Current Density Characteristics of the Sn-Ag Plating for the Wafer Bumping

  • Kim, Dong-Hyun;Lee, Seong-Jun;
    MSC Co., Ltd.;MSC Co., Ltd.;
Abstract

In this study, the effects of the concentration of metal ions and the applied current density in the Sn-Ag plating solutions were examined in regards to the resulting composition and morphology of the solder bumps` surface. Furthermore the effect of any i

Keywords Solder bump;Sn-Ag alloy;Electroplating;Stability;Purification;