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Review
- KISE Journal of Korean Institute of Surface Engineering
- Volume 50(3); 2017
- Article
Review
KISE Journal of Korean Institute of Surface Engineering 2017;50(3):170-176. Published online: Nov, 30, -0001
DOI : 10.5695/JKISE.2017.50.3.170
A Study on Electroless Palladium Layer Characteristics and Its Diffusion in the Electroless Palladium Immersion Gold (EPIG) Surface Treatment for Fine Pitch Flip Chip Package
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Surface R&D Group, Korea institute of industrial technology;Surface R&D Group, Korea institute of industrial technology;Surface R&D Group, Korea institute of industrial technology;Surface R&D Group, Korea institute of industrial technology;Surface R&D Gro
Abstract
EPIG (Electroless Pd/immersion Au) process was studied to replace ENIG (electroless Ni/immersion Au) and ENEPIG (electroless Ni/electroless Pd/immersion Au) processes for bump surface treatment used in high reliable flip chip packages. The palladium and g
Keywords Electroless palladium;Immersion gold;Amorphous;Diffusion;Shear strength;