Oct, 31, 2024

Vol.57 No.5

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  • KISE Journal of Korean Institute of Surface Engineering
  • Volume 51(1); 2018
  • Article

Review

KISE Journal of Korean Institute of Surface Engineering 2018;51(1):62-70. Published online: Nov, 30, -0001

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DOI : 10.5695/JKISE.2018.51.1.62

Effects of the Changes of Current Density and Additive Concentration on Ni Thin Films in Ni Sulfamate-chloride Electrodeposition Baths

  • Yoon, Pilgeun;Park, Deok-Yong;
    Department of Advanced Materials Engineering, Hanbat National University;Department of Advanced Materials Engineering, Hanbat National University;
Abstract

Sulfamate plating solution containing a small amount of chloride bath was fabricated to study the properties of the electrodeposited Ni thin films. Effects of the changes of current density and additive concentration on current efficiency, residual stress

Keywords Electrodeposition;Electroforming process;Additive;Micro-blade;Ni thin film;