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Review
- KISE Journal of Korean Institute of Surface Engineering
- Volume 51(4); 2018
- Article
Review
KISE Journal of Korean Institute of Surface Engineering 2018;51(4):191-196. Published online: Nov, 30, -0001
DOI : 10.5695/JKISE.2018.51.4.191
Influence of Incorporated Impurities on the Evolution of Microstructure in Electro-Deposited Copper Layer
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Surface R&D Group, Korea Institute of Industrial Technology;Surface R&D Group, Korea Institute of Industrial Technology;Surface R&D Group, Korea Institute of Industrial Technology;Surface R&D Group, Korea Institute of Industrial Technology;Surface R&D Gro
Abstract
The self-annealing which leads evolution of microstructure in copper electroplating layers at room temperature occurs after forming deposition layer. During the process, crystal orientation, size and sheet resistance of plating layer change. Lastly, it ca
Keywords self-annealing;electrodeposition copper foil;evolution of microstructure;crystal orientation;incorporated impurities;