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KISE Journal of Korean Institute of Surface Engineering 2018;51(5):263-270. Published online: Nov, 30, -0001
DOI : 10.5695/JKISE.2018.51.5.263
Ag-coated Cu dendrites were prepared as a filler for an electromagnetic interference shielding application. Ag layers on the Cu dendrites was coated by two approaches. One is a direct autocatalytic plating with a reducing agent. The other approach was ach
Keywords Electromagnetic interference shielding;Ag-coated Cu particle;Galvanic displacement;