Oct, 31, 2024

Vol.57 No.5

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  • KISE Journal of Korean Institute of Surface Engineering
  • Volume 54(3); 2021
  • Article

Review

KISE Journal of Korean Institute of Surface Engineering 2021;54(3):158-163. Published online: Jan, 3, 2022

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DOI : 10.5695/JKISE.2021.54.3.158

Introduction of Selective Electrochemical Additive Manufacturing Technology and Consideration of Integration Method for PCB Mass Production Process

  • Sung-Bin Kim1,* and Bongyoung Yoo2
    1AnyCasting Co., Ltd., B-16th FL., Woolim BLDG., 583 Yangcheon-ro, Gangseo-gu, Seoul, Korea 07547 2Dept. of Materials science and chemical engineering, Hanyang University, 55 Hanyangdaehak-ro, Sangnok-gu, Ansan-si, Gyeonggi-do, Korea 15588
Abstract

Some studies on electrochemical additive manufacturing of metals were summarized in this technical report, and development status of selective electrochemical 3D printing technology was introduced. In order to apply it to the PCB mass production process,

Keywords Copper, 3D printing, electroplating package