Oct, 31, 2024

Vol.57 No.5

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  • KISE Journal of Korean Institute of Surface Engineering
  • Volume 54(5); 2021
  • Article

Review

KISE Journal of Korean Institute of Surface Engineering 2021;54(5):207-212. Published online: Jan, 3, 2022

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DOI : 10.5695/JKISE.2021.54.5.207

FE-SEM Image Analysis of Junction Interface of Cu Direct Bonding for Semiconductor 3D Chip Stacking

  • Jaeduk Byun, June Won Hyun*
    Department of Physics, Dankook University, Dandae-ro, Dongnam-gu, Cheonan-si, Chungnam, 31116, Korea
Abstract

The mechanical and electrical characteristics can be improved in 3D stacked IC technology which can accomplish the ultra-high integration by stacking more semiconductor chips within the limited package area through the Cu direct bonding method minimizin

Keywords Semiconductors, 3D chip stacking , Cu direct bonding, Interface