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Review
- KISE Journal of Korean Institute of Surface Engineering
- Volume 55(2); 2022
- Article
Review
KISE Journal of Korean Institute of Surface Engineering 2022;55(2):102-119. Published online: May, 2, 2022
DOI : 10.5695/JSSE.2022.55.2.102
Deposition behavior of cyanide-free electroless Au plating solution using thiomalic acid as complexing agent and aminoethanethiol as reducing agent and characteristics of plated Au film
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aECTECH Co., Ltd., Incheon, 226165, Republic of Korea bMSC Co., Ltd., Incheon, 21698, Republic of Korea
Abstract
Gold plating is used as a coating of connecter in printed circuit boards, ceramic integrated circuit packages, semiconductor devices and so on, because the film has excellent electric conductivity, solderability and chemical properties such as durability
Keywords cyanide-free plating; electroless Au plating; Immersion plating; Autocatalytic plating; complexing agent; reducing agent; deposition rate; solderability.