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Review
- KISE Journal of Korean Institute of Surface Engineering
- Volume 55(4); 2022
- Article
Review
KISE Journal of Korean Institute of Surface Engineering 2022;55(4):202-214. Published online: Sep, 7, 2022
DOI : 10.5695/JSSE.2022.55.4.202
Comparison of Deposition Behavior and Properties of Cyanide-free Electroless Au Plating on Various Underlayer Electroless Ni-P films
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MSC Co., Ltd.
Abstract
Internal connections between device, package and external terminals for connecting packaging and printed circuit board are normally manufactured by electroless Ni-P plating followed by immersion Au plating (ENIG process) to ensure the connection reliabili
Keywords Cyanide-free plating; Electroless Au plating; Immersion plating; Autocatalytic plating, Deposition rate; Solderability; Particle size.