Oct, 31, 2024

Vol.57 No.5

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Review

  • KISE Journal of Korean Institute of Surface Engineering
  • Volume 55(4); 2022
  • Article

Review

KISE Journal of Korean Institute of Surface Engineering 2022;55(4):222-230. Published online: Sep, 7, 2022

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DOI : 10.5695/JSSE.2022.55.4.222

Effect of benzothiazole additives and properties of copper foils on high current density

  • Tae-Gyu Wooa,b*, Byeoung-Jae Kangc, Jong-Jae Parkc, Il-Song Parkc,d*
    a Graduate School of Flexible and Printable Electronics, Jeonbuk National University, Jeonbuk 54896, Republic of Korea b LANL-CBNU Engineering Institute Korea, Jeonbuk National University, Jeonbuk 54896, Republic of Korea c Metallurgy Engineering, Jeonbuk
Abstract

The electroplating for copper foils has many advantages in economics. During the electroplating, the selection of appropriate additives is needed to manufacture copper foils with various properties. Therefore, it is investigated the initial plating voltag

Keywords benzothiazole; copper foil; electroplating; surface roughness; additives.