Oct, 31, 2024

Vol.57 No.5

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  • KISE Journal of Korean Institute of Surface Engineering
  • Volume 55(5); 2022
  • Article

Review

KISE Journal of Korean Institute of Surface Engineering 2022;55(5):299-307. Published online: Nov, 14, 2022

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DOI : 10.5695/JSSE.2022.55.5.299

Effect of underlayer electroless Ni-P plating on deposition behavior of cyanide-free electroless Au plating

  • DongHyun Kima*, Jaeho Hanb
    aMSC Co., Ltd., Incheon, 21698, Republic of Korea bECTECH Co., Ltd., Incheon, 226165, Republic of Korea
Abstract

Gold plating is used as a coating of connector in printed circuit boards, ceramic integrated circuit packages, semiconductor devices and so on, because the film has excellent electric conductivity, solderability and chemical properties such as durability

Keywords cyanide-free plating; electroless Au plating; Immersion plating; Autocatalytic plating; deposition rate.