Oct, 31, 2024

Vol.57 No.5

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  • KISE Journal of Korean Institute of Surface Engineering
  • Volume 55(6); 2022
  • Article

Review

KISE Journal of Korean Institute of Surface Engineering 2022;55(6):460-468. Published online: Dec, 29, 2022

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DOI : 10.5695/JSSE.2022.55.6.460

Effect of addition of Tl+ and Pd2+ on the texture and hardness of the non-cyanide gold plating layer

  • Wonyoung Heo, Injoon Son*
    Department of Materials Science and Metallurgical Engineering, Kyungpook National University, Daegu 41566, Korea
Abstract

Due to its high electrical conductivity, low contact resistance, good weldability and high corrosion resi-stance, gold is widely used in electronic components such as connectors and printed circuit boards (PCB). Gold ion salts currently used in gold plati

Keywords Gold, Electroplating, Gold sulfite, Thallium, Palladium.