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Review

  • The Korean Society of Surface Science and Engineering
  • Volume 56(1); 2023
  • Article

Review

The Korean Society of Surface Science and Engineering 2023;56(1):77-83. Published online: Feb, 28, 2023

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DOI : 10.5695/JSSE.2023.56.1.77

Electrolytic silane deposition to improve the interfacial adhesion Ag and epoxy substrate

  • Wonhyo Konga,b, Gwangryeol Parkc, Hojun Ryuc, Sung-il Kangc, Inseob Baec, Seunghoe Choea,*
    aSurface & Nano Materials Division, Korea Institute of Materials Science (KIMS), 797 Changwondaero, Seongsan-gu, Changwon, Gyeongsangnam-do, 51508, Republic of Korea, bDepartment of Materials Science and Engineering, Pusan National University, Busan, 46241, Republic of Korea, cHaesung DS, 726, Ungnam-ro, Seongsan-gu, Changwon, Gyeongsangnam-do, 51552, Republic of Korea
Abstract

The reliability of leadframe-based semiconductor package depends on the adhesion between metal and epoxy molding compound (EMC). In this study, the Ag surface was electrochemically treated in a solution containing silanes in order to improve the adhesion between Ag and epoxy substrate. After electrochemical treatment, the thin silane layer was deposited on the Ag surface, whereby the peel strength between Ag and epoxy substrate was clearly improved. The improvement of peel strength depended on the functional group of silane, implying the chemical linkage between Ag and epoxy.

Keywords Adhesion promoter; silane; electrolytic treatment; leadframe; semiconductor package.