Oct, 31, 2024

Vol.57 No.5

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  • The Korean Society of Surface Science and Engineering
  • Volume 56(5); 2023
  • Article

Review

The Korean Society of Surface Science and Engineering 2023;56(5):335-340. Published online: Oct, 31, 2023

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DOI : 10.5695/JSSE.2023.56.5.335

Influence of Cu Composition on the Mechanical Properties and Microstructure of Ti–Al–Si–Cu–N thick films

  • Yeon-Hak Leea, Sung-Bo Heob, In-Wook Parkb, Daeil Kima*
    aSchool of Materials Science and Engineering, University of Ulsan, Ulsan 44610, Korea bAdvanced Hybrid Production Technology Center, Korea Institute of Industrial Technology, Yangsan 50635, Korea
Abstract

Quinary component of 3μm thick Ti-Al-Si-Cu-N films were deposited onto WC-Co and Si wafer substrates by using an arc ion plating(AIP) system. In this study, the influence of copper(Cu) contents on the mechanical properties and microstructure of the films were investigated. The hardness of the films with 3.1 at.% Cu addition exhibited the hardness value of above 42 GPa due to the microstructural change as well as the solid-solution hardening. The instrumental analyses revealed that the deposited film with Cu content of 3.1 at.% was a nano-composites with nano-sized crystallites (5–7 nm in dia.) and a thin layer of amorphous Si3N4 phase.

Keywords Ti–Al–Si–Cu–N; Nano-composite; Nano-hardness; Microstructure; Arc ion plating.