Oct, 31, 2024

Vol.57 No.5

Editorial Office

Review

  • KISE Journal of Korean Institute of Surface Engineering
  • Volume 4(1); 1971
  • Article

Review

KISE Journal of Korean Institute of Surface Engineering 1971;4(1):16-23. Published online: Nov, 30, -0001

PDF

A Study of Electro-Deposition for Pb-Sn-Cu Alloy System

  • Kang, T.;Cho, C. S.;Yum, H. T.;
    서울대학교 공과대학;한양대학교 공과대학;서울대학교 공과대학;
Abstract

In this study , fluoborte solution consisting of lead fluoborate, tin fluoborate and cupric acetate was used. By addition of small amount of Cu+= ion to the solution, the Cu content of deposition layer was almost controlled less than 5%. The amount of Cu

Keywords