Oct, 31, 2024

Vol.57 No.5

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Review

  • KISE Journal of Korean Institute of Surface Engineering
  • Volume 5(1); 1972
  • Article

Review

KISE Journal of Korean Institute of Surface Engineering 1972;5(1):1-7. Published online: Nov, 30, -0001

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Fabrication & Evaluation of electroplated Copper Foils for Printed Circuit Board Applications

  • Yoon, Y. K.;Lee, J. H.;
    원자력연구소;한국과학기술연구소 금속재료연구실;
Abstract

Copper -clad laminate(CCL) was fabricated and evaluated by bonding 35${pm}$5${mu}$ thick electroplated copper foils with a suitable adhesive to an insulating base such as phenolic resin laminate. In this study, electroplating methods

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