Dec, 31, 2024

Vol.57 No.6

Current Issue Archives
Search
Advanced Search
Editorial Office

Review

  • KISE Journal of Korean Institute of Surface Engineering
  • Volume 22(2); 1989
  • Article

Review

KISE Journal of Korean Institute of Surface Engineering 1989;22(2):47-54. Published online: Nov, 30, -0001

PDF

A Study of Intermetallic Compound Growth in the Sn/Cu and Sn/Ni Couples (II) : Sheet Resistance and Solderability Changes

  • 김홍석;이성래;
    고려대학교 금속공학과;고려대학교 금속공학과;
Abstract

The effects of intermetallic compound growt on the sheet resistance and soldreability as functions of the aging time, the temperature, and the conditions of substrates have been investi-gated in the electroplallic compound (mainy Cu6Sn5and Ni3Sn4) and the

Keywords