Oct, 31, 2024

Vol.57 No.5

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Review

  • KISE Journal of Korean Institute of Surface Engineering
  • Volume 23(4); 1990
  • Article

Review

KISE Journal of Korean Institute of Surface Engineering 1990;23(4):208-217. Published online: Nov, 30, -0001

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Plating Rate of Electroless Nikel-Copper-Phosphorus Plating and Change in Microhardness and Corrosion Rate depending on. Heat treatment

  • 오이식;황용길;
    부산공업대학 금속공학과;동아대학교 공과대학 금속공학과;
Abstract

Electroless Ni-Cu-P plating was performed was performed to investigate for plating and changes in microhardness and corrosion rate of of electroless deposits depending on heat treatment. The activation energy for $75~85^{circ}C$ were calculated

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