Oct, 31, 2024

Vol.57 No.5

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Review

  • KISE Journal of Korean Institute of Surface Engineering
  • Volume 24(4); 1991
  • Article

Review

KISE Journal of Korean Institute of Surface Engineering 1991;24(4):187-195. Published online: Nov, 30, -0001

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A study on adhesion strength of electroless plated deposits on Alumina substrate

  • 조용균;안균영;박용수;
    연세대학교 공과대학 금속공학과;연세대학교 공과대학 금속공학과;연세대학교 공과대학 금속공학과;
Abstract

Adhesion strength of electroless-plated Ni, Ni-P and Cu deposites on alumina substrate has been studied. Grain boundary spaces produced on the substrate surface by etching treatment provided anchoring sites for enhancing the adhesion strength. Adhesion s

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