Oct, 31, 2024

Vol.57 No.5

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Review

  • KISE Journal of Korean Institute of Surface Engineering
  • Volume 24(4); 1991
  • Article

Review

KISE Journal of Korean Institute of Surface Engineering 1991;24(4):196-205. Published online: Nov, 30, -0001

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A Study on the Thermal Stability in Multi-Aluminum Thin Films during Isothermal Annealing

  • 전진호;박정일;박광자;김홍대;김진영;
    광운대학교 전자재료공학과;국립공업시험원 무기화학과;국립공업시험원 무기화학과;국립공업시험원 무기화학과;광운대학교 전자재료공학과;
Abstract

Multi-level thin films are very important in ULSI applications because of their high electromigration resistance. This study presents the effects of titanium, titanium nitride and titanium tungsten underlayers of the stability of multi-aluminum thin film

Keywords