Oct, 31, 2024

Vol.57 No.5

Current Issue Archives
Search
Advanced Search
Editorial Office

Review

  • KISE Journal of Korean Institute of Surface Engineering
  • Volume 24(4); 1991
  • Article

Review

KISE Journal of Korean Institute of Surface Engineering 1991;24(4):206-214. Published online: Nov, 30, -0001

PDF

Electroless Nickel-Boron Plating on p-type Si Wafer by DMAB

  • 김영기;박종환;이원해;
    한양대학교 공과대학 금속공학과;한양대학교 공과대학 금속공학과;한양대학교 공과대학 금속공학과;
Abstract

In the basic study of selective electroless Ni plating of Si wafers, plating rate and physical properties are investigated to obtain optimum conditions of contact hole filling. Si wafers are excellently activated in the concentration of 0.5M IF, 1mM PdCl2

Keywords