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KISE Journal of Korean Institute of Surface Engineering 1992;25(3):126-132. Published online: Nov, 30, -0001
Recent VLSI requires materials with high dielectric constant in order to reduce their storage capacitor areas. Thin TaOx film was formed from Ta(OCH3)5 by photo-CVD method at a low temperature. The result shows that the film obtained by photo-CVD method i
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