Oct, 31, 2024

Vol.57 No.5

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Review

  • KISE Journal of Korean Institute of Surface Engineering
  • Volume 25(4); 1992
  • Article

Review

KISE Journal of Korean Institute of Surface Engineering 1992;25(4):173-180. Published online: Nov, 30, -0001

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Effects of Stabilizing Additives on Electroless Copper Deposition

  • 최순돈;박범동;
    영남대학교 금속공학과;영남대학교 금속공학과;
Abstract

The effects of the stabilizing additives such as NaCN, 2-MBT and Thiourea on bath decom-position, plating rate and surface morphology have been studied. Bath stability was increased in the order of an additive-free bath, and NaCN-, 2-MBT-, and Thiourea-st

Keywords