Oct, 31, 2024

Vol.57 No.5

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Review

  • KISE Journal of Korean Institute of Surface Engineering
  • Volume 25(4); 1992
  • Article

Review

KISE Journal of Korean Institute of Surface Engineering 1992;25(4):189-206. Published online: Nov, 30, -0001

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Selective Contact Hole Filling by electroless Ni Plating

  • 우찬희;권용환;김영기;박종완;이원해;
    한양대학교 공과대학 금속공학과;한양대학교 공과대학 금속공학과;한양대학교 공과대학 금속공학과;한양대학교 공과대학 금속공학과;한양대학교 공과대학 금속공학과;
Abstract

The effect of activation and electroless nickel plating conditions on contact properties was investi-gated for selective electroless nickel plating of Si wafers in order to obtain an optimum condition of con-tact hole filling. According to RCA prosess, p-

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