Oct, 31, 2024

Vol.57 No.5

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Review

  • KISE Journal of Korean Institute of Surface Engineering
  • Volume 25(6); 1992
  • Article

Review

KISE Journal of Korean Institute of Surface Engineering 1992;25(6):309-317. Published online: Nov, 30, -0001

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An investigation of characteristics of Au plating for telecommunication components

  • 한전건;강태만;
    성균관대학교 금속공학과;성균관대학교 금속공학과;
Abstract

Evaluation of electroplated gold has been carried out to obtain the data base for electrical, mechanical and environmental properties for telecommunication component applications. Gold plating was performed to a various thickness of $0.1mu extrm{m}$<

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