Oct, 31, 2024

Vol.57 No.5

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Review

  • KISE Journal of Korean Institute of Surface Engineering
  • Volume 26(3); 1993
  • Article

Review

KISE Journal of Korean Institute of Surface Engineering 1993;26(3):149-157. Published online: Nov, 30, -0001

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Pretreatment for Cu electroplating and Etching Property of Cu-Cr Film

  • Kim, N. S.;Kang, T.;Yun, I. P.;Park, Y. S.;
    Seoul National University, Dept. of Metall. Eng.;Seoul National University, Dept. of Metall. Eng.;Yonsei University, Dept. of Metall. Eng.;Yonsei University, Dept. of Metall. Eng.;
Abstract

In the study of TAB(Tape Automated Bonding)technologies, Cu-Cr sputtered seed layer has been used to improve the adhesion between Polyimide and Cu film and electrical properties. But the Cu electrodeposit on Cu-Cr film had poor adhesion or powder-like for

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