Oct, 31, 2024

Vol.57 No.5

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Review

  • KISE Journal of Korean Institute of Surface Engineering
  • Volume 26(4); 1993
  • Article

Review

KISE Journal of Korean Institute of Surface Engineering 1993;26(4):163-174. Published online: Nov, 30, -0001

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Effect of Gelatine on the Electrodeposition of Copper

  • 장영철;손헌준;
    동서산업(주) 신소재 연구소;서울대학교 공과대학 자원공학과;
Abstract

The effect of gelatine on the electrodeposition of copper in cupric sulfate-sulfuric acid solution was investi-gated using an ac impedance technique. In the presence of gelatine, the charge transfer resistance was in-creased and the electrical double lay

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