Oct, 31, 2024

Vol.57 No.5

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Review

  • KISE Journal of Korean Institute of Surface Engineering
  • Volume 26(4); 1993
  • Article

Review

KISE Journal of Korean Institute of Surface Engineering 1993;26(4):175-182. Published online: Nov, 30, -0001

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Electrochemical aspects of electroless nickel-boron plating

  • 김영기;이원해;
    한양대학교 공과대학 금속공학과;한양대학교 공과대학 금속공학과;
Abstract

Electroless plating of nickel was studied electrochemically in the presence of complexing agents. Nickel sulfate solution with dimethylamine borance(DMAB) as the reducing agent was used. Effects of temperature pH, concentration and complexing agents-citri

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