Oct, 31, 2024

Vol.57 No.5

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Review

  • KISE Journal of Korean Institute of Surface Engineering
  • Volume 26(5); 1993
  • Article

Review

KISE Journal of Korean Institute of Surface Engineering 1993;26(5):263-270. Published online: Nov, 30, -0001

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Effects of Surfactants on Electroless Copper Planting Bath for PCB

  • 이홍기;심미자;김상욱;여운관;이주성;
    한양대학교 공과대학 공업화학과;서울시립대학교 문리과대학 생명과학과;서울시립대학교 공과대학 화학공학과;홍익대학교 공과대학 금속공학과;한양대학교 공과대학 공업화학과;
Abstract

The effects of surfactants on electorless copper plating bath for PCB was studied. Basic bath composition was cuplic sulfate 10g/l, EDTA.2Na 40 g/l, formalin$ 3mell$/l and sodium hydroxide solution for pH adjust. After addition of accelerators,

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