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KISE Journal of Korean Institute of Surface Engineering 1993;26(6):327-333. Published online: Nov, 30, -0001
The effect of heat treatment on the adhesion between Cu-18wt% Cr film and polyimide has been studied by using T-peel test, AES, and XRD. Cu-18wt% Cr alloy and pure Cu films were sputter deposited onto pol-yimide. Cu was electroplated before and after he
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